• Manual wafer loading/unloading, semi-automatic process
• Overall dimension: 1500 mm×1000 mm×1600 mm
• Compatible with full-category 2D materials such as MoS₂ and graphene
• Wafer size: ≤ 4 inches
• Equipped with dry pump
• Ultimate vacuum: better than 1×10‾³ Torr
• Working vacuum: 7.5∼1×10‾³  Torr
• Heating temperature: RT ~ 400℃ (temperature control accuracy: ±1 ℃)
• Contact pressure: 0~100N adjustable
• Process/carrier gas: single-channel N₂ / Ar
• Operating system: Extremo T2.0

Application Demonstration

Transfer materials