Product Introduction: This integrated system comprises two units: the 2D semiconductor single-crystal MOCVD system (Model Oxy MOCVD 200 Ultra) on the left, and the fully automatic vacuum transfer system (Model Transfer 200 Ultra) on the right.

2D Semiconductor Single-Crystal MOCVD System

As the world’s first dedicated MOCVD system for 2D semiconductor single crystals, it is applied to the R&D and mass production of large-area high-quality single crystals such as MoS₂ and WSe₂. It is configured with 2 metal-organic sources and 2 gaseous precursors to precisely regulate source flow and temperature parameters, and adopts integrated real-time monitoring to guarantee process stability.

It achieves in-plane film uniformity above 99.5%, controllable layer thickness and low defect density. For 6-inch wafers, the carrier mobility at arbitrary positions exceeds 100 cm²V⁻¹s⁻¹. It outperforms traditional CVD systems in repeatability and stability, acting as the core equipment for next-generation integrated circuit fabrication.

Fully Automatic Vacuum Transfer System

This is the world’s first wafer-level fully automatic vacuum transfer equipment for 2D materials and advanced semiconductor processes, with completely independent intellectual property rights.

With a modular structure, it integrates ultra-high vacuum chambers for stripping, transmission and release. Equipped with a multi-DOF precision manipulator, it realizes micron-level precise positioning and damage-free transfer of wafer-level samples in a clean vacuum environment.

The whole process is completed under vacuum, effectively preventing interface contamination and structural damage. It breaks through the core technical bottleneck of 2D material transfer, and provides strategic support for the localization and leapfrog development of China’s key semiconductor technologies.